| 名次 | 關鍵字 | 指數 |
|---|---|---|
| 1 | Zhen Ding Technology | 0.000 |
| 2 | CoWoS packaging | 0.000 |
| 3 | Capital expenditure | 0.000 |
| 4 | IC substrate shortage | 0.000 |
| 5 | Unimicron | 0.000 |
| 6 | CCL | 0.000 |
| 7 | ABF substrate | 0.000 |
| 8 | BT substrate | 0.000 |
| 9 | T-glass fiberglass cloth | 0.000 |
| 10 | PCB | 0.000 |
| 名次 | 關鍵字 | 指數 |
|---|---|---|
| 1 | Zhen Ding Technology | 1.000 |
| 2 | CoWoS packaging | 1.000 |
| 3 | Capital expenditure | 1.000 |
| 4 | IC substrate shortage | 1.000 |
| 5 | Unimicron | 1.000 |
| 6 | CCL | 1.000 |
| 7 | ABF substrate | 1.000 |
| 8 | BT substrate | 1.000 |
| 9 | T-glass fiberglass cloth | 1.000 |
| 10 | PCB | 1.000 |